Manager, DRAM Product Planning

Samsung Semiconductor · San Jose, California, United States

  • Senior
  • Full-time
  • $163,000 – $253,000
  • Posted 2026-11-02
  • Confirmed live on 10 November 2026

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Job description

Please Note:

To provide the best candidate experience amidst our high application volumes, each candidate is limited to 10 applications across all open jobs within a 6-month period.

Advancing the World’s Technology Together

Our technology solutions power the tools you use every day--including smartphones, electric vehicles, hyperscale data centers, IoT devices, and so much more. Here, you’ll have an opportunity to be part of a global leader whose innovative designs are pushing the boundaries of what’s possible and powering the future.

We believe innovation and growth are driven by an inclusive culture and a diverse workforce. We’re dedicated to empowering people to be their true selves. Together, we’re building a better tomorrow for our employees, customers, partners, and communities.

What You'll Do

Samsung Semiconductor is seeking a highly motivated, strategic DRAM Product Planning Manager to drive customer adoption and secure Samsung’s position as the lead supplier for DRAM-based memory solutions across a diverse range of applications. In this role, you will act as the vital bridge between top-tier customers and our internal engineering and business teams, managing the entire lifecycle from initial design-in to final qualification.

Location: Daily onsite presence at our San Jose headquarters in alignment with our Flexible Work policy plus an average of Reports To: Staff Engineer – R&D Product Development

Technical Engagement & Engineering Collaboration

• Drive Lead Supplier Status: Lead deep technical engagements with customer engineering teams to position Samsung's DRAM solutions as the primary choice for next-generation platforms.

• Hands-on Problem Solving: Facilitate collaborative engineering debugging and troubleshooting to resolve complex technical hurdles during evaluation, qualification, and mass production.

• Application-Specific Optimization: Analyze diverse customer system architectures to proactively propose optimized, cutting-edge memory solutions.

Co-Development Process Innovation

• Align Product Roadmaps: Establish and govern a structured co-development framework that syncs the customer’s hardware roadmaps with Samsung’s memory technology pipeline.

• Define Joint Specifications: Collaborate closely with customer architects to co-define product specifications, interfaces, and feature sets that yield mutual competitive advantages.

• Feedback Loop Management: Channel critical customer architectural insights back to internal R&D and product planning teams to influence the next generation of memory products.

Business Model Development & Monetization Strategy

• Value-Value Business Modeling: Design and implement innovative business models that move beyond commodity selling, focusing on Total Cost of Ownership (TCO) reduction and value-added memory features.

• Market-Specific Strategies: Formulate customized commercial and supply structures tailored to the unique dynamics of diverse application segments (e.g., Automotive, Server, Mobile, AI/HPC).

• Strategic Partnerships: Convert technical leadership into long-term commercial value, securing multi-year agreements and deep-rooted strategic alliances.

End-to-End Project Management

• Cross-Functional Orchestration: Serve as the central program manager aligning multiple internal stakeholders—including Sales, Marketing, R&D, and Quality Assurance—with the customer’s milestones.

• Milestone Execution: Manage the entire execution pipeline from design-in, validation, and qualification (Qual) through to seamless mass production transition.

• Risk & Timeline Management: Proactively identify project risks, execute mitigation strategies, and guarantee time-to-market delivery according to aggressive customer schedules.

What You Bring

• Bachelor’s degree in Electrical Engineering, Computer Science, or related Physical Science with 10+ years of experience or Master’s degree with 8+ Years of Industry Experience or PhD with 5+ years of Industry Experience.

• Memory & System Expertise: Strong understanding of DRAM design/architecture, system-level operations (RAS, Memory Controller, memory PHY), and product support.

• Hardware Analysis: Background in SI/PI (Signal/Power Integrity) and timing measurements.

• Semiconductor Fundamentals: Familiarity with fab processes, semiconductor manufacturing, and advanced packaging.

• Deep understanding of 2.5D/3D integration (TSV, Micro-bumping, and Hybrid Bonding).

• Customer & Leadership Track Record: Proven experience in customer-facing technical roles (Applications, Design, Validation, or Dev) leading enablement and debugging.

• Mobility: Flexibility to travel based on project and customer needs.

• Experience defining architecture and specifications for next-generation Custom HBM (HBM4+).

• Ability to plan active logic base-dies that integrate core IP (Memory Controller, advanced RAS, and processing elements).

• Proven track record collaborating with foundries (e.g., TSMC/Samsung Foundry/

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